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A New Packaging Structure of Stress-Insensitive FBG Temperature Sensor
Author(s): 
Pages: 8
Year: Issue:  1
Journal: Optical Fiber & Electric Cable and Their Applications

Keyword:  光纤光栅温度传感应力不敏感封装;
Abstract: 光纤Bragg光栅(FBG)可以同时传感多个参量,但当仅需测量一个参量时.测量结果可能会受到一个或多个其他参量的影响,其中以温度和应力交叉敏感最为突出.为此,对比了其他几种应力不敏感型FBG温度传感器的优缺点,设计了一种新型的应力不敏感FBG温度传感封装结构,并通过实验验证了其温度传感性能及应力不敏感性.
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