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fei qi ji cheng dian lu hui shou chu li ji shu yan jiu
Author(s): 
Pages: 50-51
Year: Issue:  24
Journal: Household Appliance Technology

Keyword:  废弃物集成电路界面回收工艺;
Abstract: 本文研究了集成电路的材料组成、含量、存在形式和结合方式,从材料级分类回收的角度探讨了废弃集成电路的资源化回收工艺.结果表明:集成电路由铜基座、硅片、金内引线、银浆料、镀锡铜外引线、环氧膜塑料组成.硅芯片与金内引线之间没有成分的渗透;硅芯片与铜基座之间有一层银膜,银向硅渗透;镀锡铜线中铜锡之间相互渗透,铅在锡中的分布不均;内、外引线间存在银膜,银与金、铜之间都有过渡层,结合紧密.采用剪切破碎,球磨和...
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