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Effect of heat treatment on the interface of Al/Cu bimetal laminated material
Author(s): 
Pages: 5-8
Year: Issue:  5
Journal: Ordnance Material Science and Engineering

Abstract: 采用POLYVAR-MET型金相显微镜、带有GENESIS60S能谱仪的Sirion200场发射扫描电镜对经高温和低温退火处理的Al/Cu双金属复合界面组织进行观察分析,研究热处理工艺对界面组织及扩散层厚度的影响规律,并进一步通过冷轧实验研究扩散层厚度与界面结合强度的关系,获得综合满足材料结合强度和成型性能的热处理工艺.结果表明:高温退火处理的Al/Cu复合试样难以实现稳定的塑性成型,低温退火处理...
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