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feng jie cai liao
Author(s): 
Pages: 80-83
Year: Issue:  2
Journal: Optoelectronic Technology

Keyword:  封接超细粒子低膨胀系数金属氧化物热膨胀系数重量百分比铿辉石氧化钦玻璃基板石英玻璃;
Abstract: <正> 专利要求范围(1)用重量百分比表示,由软化点在450℃以下的铅-硼酸系低熔点玻璃粉占60~85%、低膨胀系数的填料占14~38%、平均粒径在1μm 以下的金属氧化物的超细粒子占0.05~15%所组成的封接材料。
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