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Development Tendency and Problem of Lead-free Solders
Author(s): 
Pages: 41-43
Year: Issue:  1
Journal: SCIENCE TECHNOLOGY

Keyword:  无铅焊接材料发展趋势;
Abstract: 无论是环境的要求还是作为竞争的筹码,无铅钎料在表面组装领域中的应用已经是不可回避.然而无铅化仍然存在材料、工艺、设备、系统兼容等问题.在解决材料及电子产品可靠性的同时,无铅产品需要开创我国自己的品牌.
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